The majority of Böning’s products are manufactured in-house, using the latest production and manufacturing facilities. They are state of the art and meet the highest quality standards.

Inspection and testing procedures are applied to meet the high demands of the ship building industry. Stress and temperature tests qualify and prepare critical components for use in tough environments.

Böning ensures consistent quality through accompanying quality assurance measures such as electromagnetic compatibility (EMV) or heat and UV irradiation tests.

SMD Production

Böning has its own SMD production line that allows them to process surface mounted devices professionally.

The production process begins with the correct and standardised storage of these sensitive SMD components. The required parts are taken from the dry-storage system and fed into a state of the art placement machine. It places up to 350 parts per minute onto the printed circuit board (PCB) with an accuracy of better than 1/100 millimeters. Prior to placement, each PCB is imprinted with solder paste which creates the connection during the later stages of the soldering process. The solder paste printer used in this process is also a precision instrument, which applies the print in the correct thickness and consistency. After visual inspection, all fully placed modules are entered into the soldering process.

THT Placement

The THT components used on the modules are wired parts i.e. contact occurs via wires that must be soldered. In Böning’s automated jig, components in this category are cut to measure and can be bent. Further processing then takes place on the placement workbench. It is a semi-automatic system which keeps all required THT components in motorized storage boxes.

Each module is programmed by a one-time process and the respective data record of all THT components is loaded into the placement workbench. Later in the process, an optical pointer targets each position to be placed on the PCB.

The designated storage box, from which the required components are taken, is opened for the placement personnel. The operator acknowledges that the placement has been completed by foot switch or hand control, and the system processes the next position. This method minimizes the potential for placement errors, ensuring a high, consistent quality standard.


The components are soldered once the placement process is completed. In order to meet all quality standards and norms, the generally high integration density requires the highest degree of precision for this production stage as well.

The SMD elements are soldered in a reflow oven which heats the modules with precisely controlled radiant heat. The solder paste melts exactly at all component connections, ensuring a secure connection. Nearly all products also include wired parts (THT components). For this, an additional soldering process is required. A solder wave system is used for the entire surface. For partial surfaces a selective solder wave is used. The latter can process single solder joints or groups of solder joints individually and exactly programmed.


Every completed component is subject to automatic optical inspection (AOI system). Any potential target deviation is detected here and the faulty module is filtered out. Generally, three separate runs for testing SMD placement, THT placement and the bottom of the PCB are provisioned. Further examinations are carried out after the final assembly. Each finished component is fully tested for functionality with the aid of an appropriate test setup.